pangb2b0312tpi1
PANDUIT GB2B0312TPI-1 StructuredGround™ Grounding Busbar Telecommunications Grounding Busbars 5/8 in, 1 in Hole spacing 508 mm
Telecommunication grounding busbar. Made of high conductivity copper and tin-plated to inhibit corrosion. Come pre-assembled with brackets and insulators attached for quick installation. 12 mounting positions of 1/4 inch stud hole with 5/8 inch hole spacing. 3 mounting positions of 3/8 inch stud hole with 1 inch hole spacing.
| Brand Name | Panduit | Sub Brand | StructuredGround™ |
| Type | Grounding Busbar | Size | 20 IN |
| Material | Copper | Finish | Tin-Plated |
| Standards | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment | Application | Telecom/Data Center |
| UPC | 074983659296 |
| 1 - Unit | 63 - Pallet |